发明授权
- 专利标题: Bond line heating pad system
- 专利标题(中): 邦德线加热垫系统
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申请号: US13848350申请日: 2013-03-21
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公开(公告)号: US08890033B2公开(公告)日: 2014-11-18
- 发明人: Mark H. Wilson
- 申请人: The Boeing Company
- 申请人地址: US IL Chicago
- 专利权人: The Boeing Company
- 当前专利权人: The Boeing Company
- 当前专利权人地址: US IL Chicago
- 主分类号: H05B1/00
- IPC分类号: H05B1/00 ; H05B3/34
摘要:
A heat pad assembly for installation and/or removal of a bracket from a structure comprises a heating element. The heat pad assembly may have at least one and, more preferably, a plurality of perforations formed therein. The heating element may be configured to generate heat upon the application of electrical current passing therethrough. The heat pad assembly may be used for temporary installation of a bracket to a mounting surface through the use of an adhesive which is installable between the bracket and the structure.
公开/授权文献
- US20130206743A1 BOND LINE HEATING PAD SYSTEM 公开/授权日:2013-08-15
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