发明授权
- 专利标题： Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate
- 专利标题（中）： 层的形成方法，有源矩阵基板的制造方法以及多层布线基板的制造方法
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申请号： US11467295申请日： 2006-08-25
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公开(公告)号： US08888229B2公开(公告)日： 2014-11-18
- 发明人: Tsuyoshi Shintate , Koichi Mizugaki , Kazuaki Sakurada , Kenji Wada
- 申请人： Tsuyoshi Shintate , Koichi Mizugaki , Kazuaki Sakurada , Kenji Wada
- 申请人地址： JP
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2005-245359 20050826; JP2006-207550 20060731
- 主分类号： B05D7/00
- IPC分类号： B05D7/00 ; H01L21/768 ; H05K3/12 ; H01L27/12 ; H01L21/288 ; G02F1/1362 ; G02F1/1337
摘要：
A method for forming a layer comprises (a) disposing a first droplet to two parts on an underlayer surface so as to form two dot patterns isolated each other on the underlayer surface, (b) fixing the two dot patterns to the underlayer surface, (c) giving lyophilicity with respect to a second droplet to at least the underlayer surface between the two dot patterns, and (d) disposing the second droplet to the underlayer surface between the two dot patterns so as to join the two dot patterns after the step (c).
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