Invention Grant
- Patent Title: Method of manufacturing interconnection member and electronic device
- Patent Title (中): 制造互连件和电子装置的方法
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Application No.: US13477245Application Date: 2012-05-22
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Publication No.: US08877584B2Publication Date: 2014-11-04
- Inventor: Koei Suzuki , Haruo Nakamura , Atsushi Onodera , Takanori Tano , Hiroshi Miura
- Applicant: Koei Suzuki , Haruo Nakamura , Atsushi Onodera , Takanori Tano , Hiroshi Miura
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- Priority: JP2011-129489 20110609; JP2012-023116 20120206
- Main IPC: H01L21/336
- IPC: H01L21/336
Abstract:
A method of manufacturing an interconnection member includes forming on a substrate a wettability changing layer containing a material in which critical surface tension is changed by giving energy; forming a depression part in the wettability changing layer by a laser ablation method using a laser of an ultraviolet region; and coating the depression part with an electrically conductive ink to form an electrically conductive part. At the same time when a pattern of the depression part is formed in the wettability changing layer, a pattern of a high surface energy area is formed as a result of the critical surface tension being changed.
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