Invention Grant
US08855785B1 Circuits for minimizing heating of an implanted lead and/or providing EMI protection in a high power electromagnetic field environment
有权
用于最小化植入引线的加热和/或在高功率电磁场环境中提供EMI保护的电路
- Patent Title: Circuits for minimizing heating of an implanted lead and/or providing EMI protection in a high power electromagnetic field environment
- Patent Title (中): 用于最小化植入引线的加热和/或在高功率电磁场环境中提供EMI保护的电路
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Application No.: US14300477Application Date: 2014-06-10
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Publication No.: US08855785B1Publication Date: 2014-10-07
- Inventor: Robert Shawn Johnson , Warren S. Dabney , Robert A. Stevenson , Christopher Michael Williams , Holly Noelle Moschiano , Scott Brainard , Daniel Robert Kaiser , Henry R. Halperin , Albert C. Lardo , Scott W. Kelley
- Applicant: Greatbatch Ltd.
- Applicant Address: US NY Clarence
- Assignee: Greatbatch Ltd.
- Current Assignee: Greatbatch Ltd.
- Current Assignee Address: US NY Clarence
- Agent Michael F. Scalise
- Main IPC: A61N1/37
- IPC: A61N1/37 ; A61N1/05 ; A61N1/08
Abstract:
An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire and at least one non-linear circuit element switch for diverting energy in the implanted lead or the leadwire to the energy dissipating surface. In alternate configurations, the switch may be disposed so that it electrically opens the implanted lead or the leadwire when diverting energy to the energy dissipating surface. The non-linear circuit element switch is typically a PIN diode.
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