发明授权
- 专利标题: FinFET with enhanced embedded stressor
- 专利标题(中): FinFET具有增强的嵌入式压力
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申请号: US13457529申请日: 2012-04-27
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公开(公告)号: US08853750B2公开(公告)日: 2014-10-07
- 发明人: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- 申请人: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Cantor Colburn LLP
- 代理商 Joseph Petrokaitis
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
A channel region of a finFET has fins having apexes in a first direction parallel to a surface of a substrate, each fin extending downwardly from the apex, with a gate overlying the apexes and between adjacent fins. A semiconductor stressor region extends in at least the first direction away from the fins to apply a stress to the channel region. Source and drain regions of the finFET can be separated from one another by the channel region, with the source and/or drain at least partly in the semiconductor stressor region. The stressor region includes a first semiconductor region and a second semiconductor region overlying and extending from the first semiconductor region. The second semiconductor region can be more heavily doped than the first semiconductor region, and the first and second semiconductor regions can have opposite conductivity types where at least a portion of the second semiconductor region meets the first semiconductor region.
公开/授权文献
- US20130285152A1 FINFET WITH ENHANCED EMBEDDED STRESSOR 公开/授权日:2013-10-31
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