发明授权
- 专利标题: Methods of forming capacitors
- 专利标题(中): 形成电容器的方法
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申请号: US13615147申请日: 2012-09-13
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公开(公告)号: US08853050B2公开(公告)日: 2014-10-07
- 发明人: Mark Kiehlbauch , Kevin R. Shea
- 申请人: Mark Kiehlbauch , Kevin R. Shea
- 申请人地址: US ID Boise
- 专利权人: Micron Technology
- 当前专利权人: Micron Technology
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John P.S.
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L27/108 ; H01L49/02
摘要:
Some embodiments include methods of making stud-type capacitors utilizing carbon-containing support material. Openings may be formed through the carbon-containing support material to electrical nodes, and subsequently conductive material may be grown within the openings. The carbon-containing support material may then be removed, and the conductive material utilized as stud-type storage nodes of stud-type capacitors. The stud-type capacitors may be incorporated into DRAM, and the DRAM may be utilized in electronic systems.
公开/授权文献
- US20130005111A1 Methods of Forming Capacitors 公开/授权日:2013-01-03
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