发明授权
US08852513B1 Systems and methods for packaging integrated circuit gas sensor systems
有权
集成电路气体传感器系统封装的系统和方法
- 专利标题： Systems and methods for packaging integrated circuit gas sensor systems
- 专利标题（中）： 集成电路气体传感器系统封装的系统和方法
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申请号： US13250810申请日： 2011-09-30
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公开(公告)号： US08852513B1公开(公告)日： 2014-10-07
- 发明人: Raymond Speer , Leon Cavanagh , Peter Smith , John Pavelka
- 申请人： Raymond Speer , Leon Cavanagh , Peter Smith , John Pavelka
- 申请人地址： US TX Austin
- 专利权人： Silicon Laboratories Inc.
- 当前专利权人： Silicon Laboratories Inc.
- 当前专利权人地址： US TX Austin
- 代理机构： Egan, Peterman & Enders LLP.
- 主分类号： G01N27/403
- IPC分类号： G01N27/403 ; G01N27/407
摘要：
Systems and methods are provided for packaging integrated circuit (IC) gas sensor systems that employ at least one gas sensor that is formed as part of an integrated circuit and configured to sense the presence and/or concentration of a target gas or other gas characteristics that may be present in the ambient gaseous environment surrounding the packaged IC gas sensor system.
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