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发明授权
US08847404B2 Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules 有权
三维半导体器件包括基于功能分子的管芯间连接

Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules
摘要：
In a stacked chip configuration, the “inter chip” connection is established on the basis of functional molecules, thereby providing a fast and space-efficient communication between the different semiconductor chips.
摘要（中）：

在堆叠式芯片配置中，基于功能分子建立“芯片间”连接，从而在不同半导体芯片之间提供快速且空间有效的通信。

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