Invention Grant
- Patent Title: Electronic device packages including bump buffer spring pads and methods of manufacturing the same
- Patent Title (中): 电子器件封装包括凸块缓冲弹簧垫及其制造方法
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Application No.: US13718311Application Date: 2012-12-18
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Publication No.: US08836118B2Publication Date: 2014-09-16
- Inventor: Tae Min Kang
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2012-0047107 20120503
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/768 ; H01L23/00 ; H01L23/31
Abstract:
Electronic device packages and related methods are provided. The electronic device package includes a first substrate having a first contact portion disposed thereon, a bump having a first contact surface connected to the first contact portion and a second contact surface disposed opposite to the first contact surface, and a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. The buffer spring pad portion includes at least two different conductive material layers which are stacked.
Public/Granted literature
- US20130292820A1 ELECTRONIC DEVICE PACKAGES INCLUDING BUMP BUFFER SPRING PADS AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2013-11-07
Information query
IPC分类:
