Invention Grant
US08810261B2 In-mould molding touch module and method for manufacturing the same 有权
模内成型触摸模块及其制造方法

  • Patent Title: In-mould molding touch module and method for manufacturing the same
  • Patent Title (中): 模内成型触摸模块及其制造方法
  • Application No.: US13372499
    Application Date: 2012-02-14
  • Publication No.: US08810261B2
    Publication Date: 2014-08-19
  • Inventor: Min-Yi Lee
  • Applicant: Min-Yi Lee
  • Applicant Address: TW Taipei
  • Assignee: TPK Touch Solutions Inc.
  • Current Assignee: TPK Touch Solutions Inc.
  • Current Assignee Address: TW Taipei
  • Agent Gokalp Bayramoglu
  • Priority: TW96139593A 20071023
  • Main IPC: G01R27/26
  • IPC: G01R27/26
In-mould molding touch module and method for manufacturing the same
Abstract:
An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
Information query
Patent Agency Ranking
0/0