发明授权
US08810016B2 Semiconductor device, substrate and semiconductor device manufacturing method
有权
半导体器件，衬底和半导体器件的制造方法
- 专利标题： Semiconductor device, substrate and semiconductor device manufacturing method
- 专利标题（中）： 半导体器件，衬底和半导体器件的制造方法
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申请号： US13036869申请日： 2011-02-28
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公开(公告)号： US08810016B2公开(公告)日： 2014-08-19
- 发明人: Yasumasa Kasuya , Motoharu Haga , Hiroaki Matsubara
- 申请人： Yasumasa Kasuya , Motoharu Haga , Hiroaki Matsubara
- 申请人地址： JP Kyoto
- 专利权人： Rohm Co., Ltd.
- 当前专利权人： Rohm Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Rabin & Berdo, P.C.
- 优先权： JP2005-165800 20050606; JP2005-266004 20050913
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane.
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