发明授权
- 专利标题: Liquid jetting apparatus, connecting structure of substrate, and method for manufacturing liquid jetting apparatus
- 专利标题(中): 液体喷射装置,基板的连接结构和液体喷射装置的制造方法
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申请号: US13849617申请日: 2013-03-25
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公开(公告)号: US08789931B2公开(公告)日: 2014-07-29
- 发明人: Hiroto Sugahara , Shuhei Hiwada
- 申请人: Hiroto Sugahara , Shuhei Hiwada
- 申请人地址: JP Aichi-ken
- 专利权人: Brother Kogyo Kabushiki Kaisha
- 当前专利权人: Brother Kogyo Kabushiki Kaisha
- 当前专利权人地址: JP Aichi-ken
- 代理机构: Frommer Lawrence & Haug LLP
- 优先权: JP2012-217122 20120928
- 主分类号: B41J2/045
- IPC分类号: B41J2/045 ; H04R17/00 ; B41J2/14 ; B41J2/16
摘要:
There is provided a liquid jetting apparatus which includes: a liquid jetting head including a channel unit and a piezoelectric actuator, an elastic deformation layer arranged on the piezoelectric actuator, a plurality of head-side contact points arranged on the elastic deformation layer, a substrate arranged to face a surface of the liquid jetting head, a plurality of substrate-side contact points arranged on the substrate, and a fixing member fixing the liquid jetting head and the substrate. When the fixing member fixes the liquid jetting head and the substrate, a portion of the elastic deformation layer, on which the head-side contact points are arranged, is sandwiched by the piezoelectric actuator and the substrate to undergo elastic deformation. The elastic deformation layer is configured to press the plurality of head-side contact points onto the substrate-side contact points by a force arising from a tendency to restore a state before elastic deformation.
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