Invention Grant
- Patent Title: Housing components for electronic devices
- Patent Title (中): 电子设备的外壳部件
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Application No.: US12186990Application Date: 2008-08-06
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Publication No.: US08776358B2Publication Date: 2014-07-15
- Inventor: Todd F. Gotham , Andrew David Lauder , Tang Yew Tan , Erik L. Wang , Phillip Michael Hobson , Richard Hung Minh Dinh , Christopher Stringer , Richard Howarth , John Ternus , Rico Zorkendorfer
- Applicant: Todd F. Gotham , Andrew David Lauder , Tang Yew Tan , Erik L. Wang , Phillip Michael Hobson , Richard Hung Minh Dinh , Christopher Stringer , Richard Howarth , John Ternus , Rico Zorkendorfer
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/04
Abstract:
Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.
Public/Granted literature
- US20090040703A1 HOUSING COMPONENTS FOR ELECTRONIC DEVICES AND METHODS FOR CONSTRUCTING THE SAME Public/Granted day:2009-02-12
Information query
