Invention Grant
- Patent Title: Component cooling channel
- Patent Title (中): 组件冷却通道
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Application No.: US12985553Application Date: 2011-01-06
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Publication No.: US08764394B2Publication Date: 2014-07-01
- Inventor: Ching-Pang Lee , John J. Marra , Gary B. Merrill , Benjamin E. Heneveld , Jill Klinger
- Applicant: Ching-Pang Lee , John J. Marra , Gary B. Merrill , Benjamin E. Heneveld , Jill Klinger
- Applicant Address: US FL Orlando US VA Charlottesville
- Assignee: Siemens Energy, Inc.,Mikro Systems, Inc.
- Current Assignee: Siemens Energy, Inc.,Mikro Systems, Inc.
- Current Assignee Address: US FL Orlando US VA Charlottesville
- Main IPC: F01D5/18
- IPC: F01D5/18 ; F28F3/04 ; F28F7/02

Abstract:
A cooling channel (36, 36B) cools an exterior surface (40 or 42) or two opposed exterior surfaces (40 and 42). The channel has a near-wall inner surface (48, 50) with a width (W1). Interior side surfaces (52, 54) may converge to a reduced channel width (W2). The near-wall inner surface (48, 50) may have fins (44) aligned with a coolant flow (22). The fins may highest at mid-width of the near-wall inner surface. A two-sided cooling channel (36) may have two near-wall inner surfaces (48, 50) parallel to two respective exterior surfaces (40, 42), and may have an hourglass shaped transverse sectional profile. The tapered channel width (W1, W2) and the fin height profile (56A, 56B) increases cooling flow (22) into the corners (C) of the channel for more uniform and efficient cooling.
Public/Granted literature
- US20120177503A1 COMPONENT COOLING CHANNEL Public/Granted day:2012-07-12
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