发明授权
- 专利标题： Hermetically sealed housing for electronic components and manufacturing method
- 专利标题（中）： 电子元器件密封外壳及制造方法
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申请号： US12993299申请日： 2009-05-26
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公开(公告)号： US08759677B2公开(公告)日： 2014-06-24
- 发明人: Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
- 申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
- 申请人地址： DE Munich
- 专利权人： Epcos AG
- 当前专利权人： Epcos AG
- 当前专利权人地址： DE Munich
- 代理机构： Nixon Peabody LLP
- 优先权： DE102008025202 20080527
- 国际申请： PCT/EP2009/056377 WO 20090526
- 国际公布： WO2009/144224 WO 20091203
- 主分类号： H01J5/00
- IPC分类号： H01J5/00 ; H01J15/00 ; H05K5/06 ; H05H1/00 ; H05K7/00 ; H05K7/10 ; H05K7/12
摘要：
Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
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