Invention Grant
- Patent Title: Photoresist composition
- Patent Title (中): 光刻胶组成
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Application No.: US13428555Application Date: 2012-03-23
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Publication No.: US08753795B2Publication Date: 2014-06-17
- Inventor: Koji Ichikawa , Hiromu Sakamoto , Yuichi Mukai
- Applicant: Koji Ichikawa , Hiromu Sakamoto , Yuichi Mukai
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Chemical Company, Limited
- Current Assignee: Sumitomo Chemical Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-070035 20110328; JP2011-105140 20110510
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/30
Abstract:
The present invention provides a photoresist composition containing: a resin which contains a structural unit derived from a compound having an acid-labile group and which is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid; an acid generator and a compound represented by the formula (I): wherein R1, X1, R2, u1, s1, t1 are each defined in the specification, with the proviso that sum of s1 and t1 is 1 or 2.
Public/Granted literature
- US20120251945A1 PHOTORESIST COMPOSITION Public/Granted day:2012-10-04
Information query
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