Invention Grant
- Patent Title: Non-volatile memory utilizing impact ionization and tunnelling and method of manufacturing thereof
- Patent Title (中): 利用冲击电离和隧穿的非易失性存储器及其制造方法
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Application No.: US12456440Application Date: 2009-06-16
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Publication No.: US08750037B2Publication Date: 2014-06-10
- Inventor: Eng Huat Toh , Chung Foong Tan , Shyue Seng Tan , Jae Gon Lee , Elgin Quek
- Applicant: Eng Huat Toh , Chung Foong Tan , Shyue Seng Tan , Jae Gon Lee , Elgin Quek
- Applicant Address: SG Singapore
- Assignee: Globalfoundries Singapore PTE. Ltd.
- Current Assignee: Globalfoundries Singapore PTE. Ltd.
- Current Assignee Address: SG Singapore
- Agent Robert D. McCutcheon
- Main IPC: G11C16/04
- IPC: G11C16/04

Abstract:
A non-volatile memory device (and method of manufacture) is disclosed and structured to enable a write operation using an ionization impact process in a first portion of the device and a read operation using a tunneling process in a second portion of the device. The non-volatile memory device (1) increases hot carrier injection efficiency, (2) decreases power consumption, and (3) enables voltage and device scaling in the non-volatile memory devices.
Public/Granted literature
- US20100315884A1 Non-volatile memory utilizing impact ionization and tunnelling and method of manufacturing thereof Public/Granted day:2010-12-16
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