An electrical connector adapted for being soldered to a circuit board includes an insulating housing, a shielding shell enclosing the insulating housing, a first terminal pack and a second terminal pack. The first terminal pack includes a first main body, and a plurality of first terminals molded to the first main body. The second terminal pack includes a second main body, and a plurality of second terminals molded to the second main body. The first terminal pack is engaged with the second terminal pack with first soldering portions of the first terminals and second soldering portions of the second terminals being alternately aligned in line to make all of the soldering portions show a single-row arrangement for being soldered with the circuit board. The first and second terminal packs are assembled to the insulating housing together with the shielding shell.