Invention Grant
- Patent Title: Nitride semiconductor element and manufacturing method therefor
- Patent Title (中): 氮化物半导体元件及其制造方法
-
Application No.: US13596849Application Date: 2012-08-28
-
Publication No.: US08729587B2Publication Date: 2014-05-20
- Inventor: Toshiya Yokogawa , Mitsuaki Oya , Atsushi Yamada , Ryou Kato
- Applicant: Toshiya Yokogawa , Mitsuaki Oya , Atsushi Yamada , Ryou Kato
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2010-085221 20100401
- Main IPC: H01L33/30
- IPC: H01L33/30 ; H01L33/50

Abstract:
An exemplary nitride-based semiconductor device includes: a nitride-based semiconductor multilayer structure 20 which has a p-type GaN-based semiconductor region whose surface 12 is inclined from the m-plane by an angle of not less than 1° and not more than 5° or the principal surface has a plurality of m-plane steps; and an electrode 30 that is arranged on the p-type GaN-based semiconductor region. The electrode 30 includes a Mg alloy layer 32 which is formed from Mg and metal selected from a group consisting of Pt, Mo, and Pd. The Mg alloy layer 32 is in contact with the surface 12 of the p-type GaN-based semiconductor region of the semiconductor multilayer structure 20.
Public/Granted literature
- US20120319156A1 NITRIDE SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2012-12-20
Information query
IPC分类: