Invention Grant
- Patent Title: Method of making a die with recessed aluminum die pads
- Patent Title (中): 用凹槽铝模片制作模具的方法
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Application No.: US13192976Application Date: 2011-07-28
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Publication No.: US08722530B2Publication Date: 2014-05-13
- Inventor: Gregory S. Spencer , Phillip E. Crabtree , Dean J. Denning , Kurt H. Junker , Gerald A. Martin
- Applicant: Gregory S. Spencer , Phillip E. Crabtree , Dean J. Denning , Kurt H. Junker , Gerald A. Martin
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent David G. Dolezal; Mary Jo Bertani
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L33/62 ; H01L21/768 ; H01L23/488
Abstract:
A method for making a semiconductor device comprises forming an electrical interconnect layer, forming a first dielectric layer over the interconnect layer, forming an opening in the first dielectric layer over a first electrical interconnect of the interconnect layer, forming an aluminum layer over the first dielectric layer, etching the aluminum layer to form an aluminum die pad, forming a second dielectric layer over the aluminum die pad and the first dielectric layer, and forming a conductive via through the first and second dielectric layers to contact a second electrical interconnect of the interconnect layer.
Public/Granted literature
- US20130029485A1 METHOD OF MAKING A DIE WITH RECESSED ALUMIUM DIE PADS Public/Granted day:2013-01-31
Information query
IPC分类:
