Invention Grant
- Patent Title: Area optimized series gate layout structure for FINFET array
- Patent Title (中): FINFET阵列的面积优化系列门极布局结构
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Application No.: US13778403Application Date: 2013-02-27
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Publication No.: US08719759B1Publication Date: 2014-05-06
- Inventor: Wen-Shen Chou , Chin-Hua Wen , Yung-Chow Peng , Chih-Chiang Chang
- Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The present disclosure relates to a method of optimizing the area of series gate layout structures for FinFET devices. The method analyzes an integrated chip (IC) layout to determine a first gate material density along a first direction and to separately determine a second gate material density along a second direction based upon the first gate material density. A number of series gate stages for a FinFET (field effect transistor) device having a gate length along the second direction, is chosen based upon the second gate material density and one or more device performance parameters of the FinFET device. By analyzing the density of gate material in separate directions, the effective length of the gate of the FinFET can be increased without increasing the size of the transistor array.
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