发明授权
- 专利标题: Structure to reduce electroplated stabilizer content
- 专利标题(中): 结构减少电镀稳定剂含量
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申请号: US12882654申请日: 2010-09-15
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公开(公告)号: US08716188B2公开(公告)日: 2014-05-06
- 发明人: Yi-Yuan Xie , Kenneth P. Lenseth , Justin Waterman , Venkat Selvamanickam
- 申请人: Yi-Yuan Xie , Kenneth P. Lenseth , Justin Waterman , Venkat Selvamanickam
- 申请人地址: US NY Schenectady
- 专利权人: SuperPower, Inc.
- 当前专利权人: SuperPower, Inc.
- 当前专利权人地址: US NY Schenectady
- 代理机构: Abel Law Group, LLP
- 代理商 Thomas P. Weber
- 主分类号: H01L39/24
- IPC分类号: H01L39/24 ; H01B12/02
摘要:
A superconducting article includes first and second stacked conductor segments. The first stacked conductor segment includes first and second superconductive segments and has a nominal thickness tn1. The second stacked conductor segment includes third and forth superconductive segments and has a nominal thickness tn2. The superconducting article further includes a joint region comprising a first splice connecting the first and third superconductive segments together and a second splice connecting the second and forth superconductive segments together. The first splice is adjacent to and bridged portions of the first and third superconductive segments along at least a portion of the joint region, and the second splice is adjacent to and bridged portions of the second and forth superconductive segments along at least a portion of the joint region. The joint region has a thickness tjr, wherein tjr is not greater than at least one of 1.8tn1 and 1.8tn2.
公开/授权文献
- US20120065074A1 STRUCTURE TO REDUCE ELECTROPLATED STABILIZER CONTENT 公开/授权日:2012-03-15
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