发明授权
- 专利标题: Release layer
- 专利标题(中): 释放层
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申请号: US13259115申请日: 2009-08-17
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公开(公告)号: US08712298B2公开(公告)日: 2014-04-29
- 发明人: Raia Slivniak-Zozin , Nava Klein , Fernanda Orlik , Naseem Yacoub , Oshra Raviv , Meir Soria
- 申请人: Raia Slivniak-Zozin , Nava Klein , Fernanda Orlik , Naseem Yacoub , Oshra Raviv , Meir Soria
- 申请人地址: NL Maastricht
- 专利权人: Hewlett-Packard Indigo B.V.
- 当前专利权人: Hewlett-Packard Indigo B.V.
- 当前专利权人地址: NL Maastricht
- 国际申请: PCT/IB2009/006717 WO 20090817
- 国际公布: WO2011/021061 WO 20110224
- 主分类号: G03G15/14
- IPC分类号: G03G15/14
摘要:
At least a portion of an intermediate transfer member includes a release layer facing outwardly from and supported by a supportive portion. The release layer includes an inner layer and an outer layer over and in contact with the inner layer, The inner layer has a thickness of between about 1 μm and about 8 μm and a bulk swelling of between 120% and 350%. The outer layer has a thickness of less than about 5 μm and a bulk swelling of less than 120%.
公开/授权文献
- US20120134695A1 RELEASE LAYER 公开/授权日:2012-05-31
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