Invention Grant
- Patent Title: Mechanisms for marking the orientation of a sawed die
- Patent Title (中): 用于标记锯模的取向的机构
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Application No.: US13180208Application Date: 2011-07-11
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Publication No.: US08710630B2Publication Date: 2014-04-29
- Inventor: Hsien-Wei Chen
- Applicant: Hsien-Wei Chen
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06
Abstract:
Mechanisms for identifying orientation of a sawed die are provided. By making metal pattern in the corner stress relief region in one corner of the die different from the other corners, users can easily identify the orientation of the die.
Public/Granted literature
- US20130015561A1 MECHANISMS FOR MARKING THE ORIENTATION OF A SAWED DIE Public/Granted day:2013-01-17
Information query
IPC分类:
