发明授权
- 专利标题: Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate
- 专利标题(中): 碳化硅衬底,外延晶片和碳化硅衬底的制造方法
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申请号: US13310203申请日: 2011-12-02
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公开(公告)号: US08709950B2公开(公告)日: 2014-04-29
- 发明人: Makoto Sasaki , Shin Harada
- 申请人: Makoto Sasaki , Shin Harada
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2009-004839 20090113
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
An SiC substrate includes the steps of preparing a base substrate having a main surface and made of SiC, washing the main surface using a first alkaline solution, and washing the main surface using a second alkaline solution after the step of washing with the first alkaline solution. The SiC substrate has the main surface, and an average of residues on the main surface are equal to or larger than 0.2 and smaller than 200 in number.
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