发明授权
US08687442B1 Delay matching across semiconductor devices using input/output pads 有权
使用输入/输出焊盘延迟半导体器件的匹配

Delay matching across semiconductor devices using input/output pads
摘要:
A data signal is sampled by generating a read enable signal at a first semiconductor device which is intended for a second semiconductor device. A read enable signal with at least some I/O pad delay included is obtained, including by passing the read enable signal intended for the second semiconductor device at least partially through an input/output (I/O) pad on the first semiconductor device. At the first semiconductor device, a data signal from the second semiconductor is sampled using the read enable signal with at least some I/O pad delay included.
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