发明授权
US08687442B1 Delay matching across semiconductor devices using input/output pads
有权
使用输入/输出焊盘延迟半导体器件的匹配
- 专利标题: Delay matching across semiconductor devices using input/output pads
- 专利标题(中): 使用输入/输出焊盘延迟半导体器件的匹配
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申请号: US13291629申请日: 2011-11-08
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公开(公告)号: US08687442B1公开(公告)日: 2014-04-01
- 发明人: Priyanka Thakore , Meng-Kun Lee
- 申请人: Priyanka Thakore , Meng-Kun Lee
- 申请人地址: US CA San Jose
- 专利权人: SK hynix memory solutions inc.
- 当前专利权人: SK hynix memory solutions inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Van Pelt, Yi & James LLP
- 主分类号: G11C7/00
- IPC分类号: G11C7/00
摘要:
A data signal is sampled by generating a read enable signal at a first semiconductor device which is intended for a second semiconductor device. A read enable signal with at least some I/O pad delay included is obtained, including by passing the read enable signal intended for the second semiconductor device at least partially through an input/output (I/O) pad on the first semiconductor device. At the first semiconductor device, a data signal from the second semiconductor is sampled using the read enable signal with at least some I/O pad delay included.
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