发明授权
- 专利标题： Method for manufacturing substrate for semiconductor light emitting element and semiconductor light emitting element using the same
- 专利标题（中）： 一种半导体发光元件用基板的制造方法及使用其的半导体发光元件
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申请号： US13759892申请日： 2013-02-05
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公开(公告)号： US08686457B2公开(公告)日： 2014-04-01
- 发明人: Shunsuke Minato , Junya Narita , Yohei Wakai , Yukio Narukawa , Motokazu Yamada
- 申请人： Nichia Corporation
- 申请人地址： JP Anan-Shi
- 专利权人： Nichia Corporation
- 当前专利权人： Nichia Corporation
- 当前专利权人地址： JP Anan-Shi
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2006-344482 20061221; JP2007-271764 20071018
- 主分类号： H01L31/0232
- IPC分类号： H01L31/0232
摘要：
A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.
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