A light-emitting diode (“LED”) package includes a light-emitting chip, a case, first and second lead frames and a dummy lead frame. The light-emitting chip generates light. The case includes a bottom portion and a plurality of sidewalls, wherein the light-emitting chip is positioned in the case. The first and second lead frames are spaced apart from each other and are electrically connected to the light-emitting chip. The dummy lead frame is spaced apart from the light-emitting chip and the first and second lead frames, and is electrically isolated from the light-emitting chip and the first and second lead frames. The dummy lead frame is used as a wiring for connecting the LED package to another LED package, so that the number of signal wirings or a length of a signal wiring may be decreased, and a manufacturing cost of the LED package may be reduced.