发明授权
US08684274B2 Cooling enhancements in thin films using flexible complex seal due to temperature increase or thermal load increase
失效
由于温度升高或热负荷增加，使用柔性复合密封的薄膜中的冷却增强
- 专利标题： Cooling enhancements in thin films using flexible complex seal due to temperature increase or thermal load increase
- 专利标题（中）： 由于温度升高或热负荷增加，使用柔性复合密封的薄膜中的冷却增强
-
申请号： US13026477申请日： 2011-02-14
-
公开(公告)号： US08684274B2公开(公告)日： 2014-04-01
- 发明人: Kambiz Vafai , Abdul Rahim A. Khaled
- 申请人： Kambiz Vafai , Abdul Rahim A. Khaled
- 申请人地址： US NM Albuquerque
- 专利权人： Kambix Innovations, LLC
- 当前专利权人： Kambix Innovations, LLC
- 当前专利权人地址： US NM Albuquerque
- 代理机构： Ortiz & Lopez, PLLC
- 代理商 Kermit D. Lopez; Luis M. Ortiz
- 主分类号： G05D23/00
- IPC分类号： G05D23/00
摘要：
A cooling enhancement apparatus includes a first substrate and a second substrate, the first substrate having a face in contact with at least one hot medium and having another face in contact with a secondary gas. The second substrate includes a face in contact with the secondary gas and has the other face in contact with a main gas. The faces of the first and second substrates in contact with the secondary gas generally oppose each other. One or more flexible seals can be attached to the first substrate and to the second substrate to form one or more closed enclosures including the secondary gas so that the second substrate moves relative to the first substrate when the secondary gas undergoes volumetric thermal expansion.
公开/授权文献
信息查询
