A bundled wire guide is insertable within an interior portion of a carrier/telecommunication module assembly. The bundled wire guide includes at least one channel configured to receive and guide at least a first wire bundle such that the at least one channel extends from a back frame of the carrier to a hinge portion of the telecommunication module and individual wires of the first wire bundle are insertable in the telecommunication module. The bundled wire guide, when installed as part of the carrier, provides one or more closed wire channels that mechanically protect the wire bundles. In addition, the bundled wire guide provides a mechanism to install wires through the back frame of the carrier without having to open or pivot the carrier/module assembly.