A circuit compatible with dynamic random access memories (DRAM) and static random access memories (SRAM) is disclosed. The circuit includes a substrate having a first conductivity type. A trench isolation region (850,852) is formed in the substrate. The trench isolation region has sides and a bottom formed below a face of the substrate. A first semiconductor region having a second conductivity type (868) is formed at the bottom of the trench isolation region. A second semiconductor region having the second conductivity type (870) is formed separately from the first semiconductor region adjacent a first side of trench isolation region and in conductive contact with the first semiconductor region.