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US08674452B2 Semiconductor device with lower metal layer thickness in PMOS region 有权
在PMOS区域具有较低金属层厚度的半导体器件

Semiconductor device with lower metal layer thickness in PMOS region
Abstract:
A semiconductor device includes: a substrate having a first region and a second region; a first gate structure disposed on the first region, wherein the first gate structure comprises a first high-k dielectric layer, a first work function metal layer, and a first metal layer disposed between the first high-k dielectric layer and the first work function metal layer; and a second gate structure disposed on the second region, wherein the second gate structure comprises a second high-k dielectric layer, a second work function metal layer, and a second metal layer disposed between the second high-k dielectric layer and the second work function metal layer, wherein the thickness of the second metal layer is lower than the thickness of the first metal layer.
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