An electronic package implemented in an electronic device may include a damaged connection that restricts electrical communication between components in the electronic package. For example, the damaged connection may restrict communication between a silicon unit, such as a processor die for example, and a printed circuit board. The damaged connection may be repaired without damaging other components in the electronic package by using a repair apparatus that includes a heating element and a cooling element. The heating element may be activated to transfer heat to the electronic package for reforming the damaged connection between components to enable effective electrical communication. The cooling element may be activated for cooling components in the electronic package to prevent damage due to the transfer of the heat from the heating element. The heating element and/or the cooling element may be activated in a predetermined pattern to facilitate the repair of the damaged connection.