Invention Grant
- Patent Title: Crosstalk-free WLCSP structure for high frequency application
- Patent Title (中): 无串扰WLCSP结构，适用于高频应用
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Application No.: US11782384Application Date: 2007-07-24
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Publication No.: US08669658B2Publication Date: 2014-03-11
- Inventor: Mon-Chin Tsai , Hsiu-Mei Yo , Chien-Min Lin , Chia-Jen Cheng , Li-Hsin Tseng
- Applicant: Mon-Chin Tsai , Hsiu-Mei Yo , Chien-Min Lin , Chia-Jen Cheng , Li-Hsin Tseng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.
Public/Granted literature
- US20090026608A1 Crosstalk-Free WLCSP Structure for High Frequency Application Public/Granted day:2009-01-29
Information query
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