Invention Grant
- Patent Title: Silver alloy, sputtering target material thereof, and thin film thereof
- Patent Title (中): 银合金,溅射靶材料及其薄膜
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Application No.: US12882413Application Date: 2010-09-15
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Publication No.: US08668787B2Publication Date: 2014-03-11
- Inventor: Atsushi Watanabe
- Applicant: Atsushi Watanabe
- Applicant Address: JP Tokyo
- Assignee: Furuya Metal Co., Ltd.
- Current Assignee: Furuya Metal Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-335760 20030926; JP2004-120080 20040415
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C22C5/06

Abstract:
It is an object of the present invention to provide a Ag—Pd—Cu—Ge type silver alloy which can form a reflective electrode film having such two characteristics that it is very reduced in the lowering of reflectance caused by thermal deterioration and has resistant to yellowing caused by sulfurization even after a heating step in a process of producing a color liquid crystal display. The silver alloy according to the present invention includes a composition containing at least four elements including Ag as its major component, 0.10 to 2.89 wt % of Pd, 0.10 to 2.89 wt % of Cu and 0.01 to 1.50 wt % of Ge, and the total amount of Pd, Cu and Ge is 0.21 to 3.00 wt %.
Public/Granted literature
- US20110003173A1 SILVER ALLOY, SPUTTERING TARGET MATERIAL THEREOF, AND THIN FILM THEREOF Public/Granted day:2011-01-06
Information query
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