Invention Grant
- Patent Title: Implanting method for forming photodiode
- Patent Title (中): 用于形成光电二极管的植入方法
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Application No.: US13410165Application Date: 2012-03-01
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Publication No.: US08652868B2Publication Date: 2014-02-18
- Inventor: Yu-Shen Shih , Ching-Hwanq Su , Wei-Ming You , Chih-Cherng Jeng , Kuo-Cheng Lee , Yen-Hsung Ho
- Applicant: Yu-Shen Shih , Ching-Hwanq Su , Wei-Ming You , Chih-Cherng Jeng , Kuo-Cheng Lee , Yen-Hsung Ho
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An implanting method for forming a photodiode comprises providing a substrate with a first conductivity, growing an epitaxial layer on the substrate, implanting ions with a second conductivity in the epitaxial layer from a front side of the substrate and implanting ions with the first conductivity in the epitaxial layer from the front side of the substrate to form a photo active region adjacent to the front side and a photo inactive region underneath the photo active region. By employing the implanting method, an average doping density of the photo active region is approximately ten times more than an average doping density of the photo inactive region.
Public/Granted literature
- US20130230941A1 Implanting Method for Forming Photodiode Public/Granted day:2013-09-05
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