A system and method for cooling an electronic image assembly having a plurality of cooling gas pathways place behind the electronic image assembly. A first fan may be used to force cooling gas through a first grouping of cooling gas pathways while a second fan may be used to force cooling gas through a second grouping of cooling gas pathways. Temperature sensing devices may be positioned so as to measure the temperature of the first and second groupings of cooling gas pathways. The speeds of the first and second fans may be adjusted based on the temperature measurements of the cooling gas pathway groupings. Additional fans with additional temperature sensing devices may be used for further accuracy and control over the temperature gradients of the electronic image assembly. Manifolds may be used to distribute/collect cooling gas to/from the cooling gas pathways.