Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13121122Application Date: 2010-05-12
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Publication No.: US08648349B2Publication Date: 2014-02-11
- Inventor: Takeyoshi Masuda , Misako Honaga
- Applicant: Takeyoshi Masuda , Misako Honaga
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2009-189152 20090818
- International Application: PCT/JP2010/058019 WO 20100512
- International Announcement: WO2011/021413 WO 20110224
- Main IPC: H01L29/15
- IPC: H01L29/15

Abstract:
A MOSFET which is a semiconductor device capable of achieving a stable reverse breakdown voltage and reduced on-resistance includes a SiC wafer of an n conductivity type, a plurality of p bodies of a p conductivity type formed to include a first main surface of the SiC wafer, and n+ source regions of the n conductivity type formed in regions surrounded by the plurality of p bodies, respectively, when viewed two-dimensionally. Each of the p bodies has a circular shape when viewed two-dimensionally, and each of the n+ source regions is arranged concentrically with each of the p bodies and has a circular shape when viewed two-dimensionally. Each of the plurality of p bodies is arranged to be positioned at a vertex of a regular hexagon when viewed two-dimensionally.
Public/Granted literature
- US20110180812A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-07-28
Information query
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