发明授权
- 专利标题： Multi-chip package with pillar connection
- 专利标题（中）： 多芯片封装，支柱连接
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申请号： US13088817申请日： 2011-04-18
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公开(公告)号： US08637984B2公开(公告)日： 2014-01-28
- 发明人: Roland Schuetz
- 申请人： Roland Schuetz
- 申请人地址： CA Ottawa, Ontario
- 专利权人： Mosaid Technologies Incorporated
- 当前专利权人： Mosaid Technologies Incorporated
- 当前专利权人地址： CA Ottawa, Ontario
- 代理商 Harvey Auerback
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/58
摘要：
A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.
公开/授权文献
- US20110298128A1 MULTI-CHIP PACKAGE WITH PILLAR CONNECTION 公开/授权日：2011-12-08
信息查询
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