发明授权
- 专利标题： Integrated circuit package system and method of manufacture thereof
- 专利标题（中）： 集成电路封装系统及其制造方法
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申请号： US12723596申请日： 2010-03-12
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公开(公告)号： US08633056B2公开(公告)日： 2014-01-21
- 发明人: Hyung Jun Jeon , Tae Keun Lee , Sung Soo Kim
- 申请人： Hyung Jun Jeon , Tae Keun Lee , Sung Soo Kim
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/02
摘要：
A method of manufacture of an integrated circuit package system includes forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.
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