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发明授权
US08618678B2 Chip structure and chip package structure 有权
芯片结构和芯片封装结构

Chip structure and chip package structure
摘要：
A chip structure and a chip package structure are disclosed herein. The chip structure includes a chip and a bump. The chip includes at least one pad. The bump is disposed on a bounding region of the pad. The shape of the bump is triangular pillar or trapezoidal pillar. A surface area of connection between the bump and the pad is less than or equal to the bounding region. Therefore, the material usage and the cost of the bump can be reduced. In addition, such shape of the bump has directional characteristic so that it is easy to perform the chip testing via the identifiable pads, and perform the package process of bonding the chip to a circuit board or any carriers.
摘要（中）：

本文公开了一种芯片结构和芯片封装结构。 芯片结构包括芯片和凸块。 该芯片包括至少一个焊盘。 凸块设置在垫的边界区域上。 凸块的形状是三角柱或梯形柱。 凸起和垫之间的连接表面积小于或等于边界区域。 因此，可以减少材料的使用和冲击的成本。 此外，凸起的这种形状具有方向特性，使得容易通过可识别的焊盘执行芯片测试，并且执行将芯片接合到电路板或任何载体的封装处理。

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