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US08615149B2 Photonics chip with efficient optical alignment and bonding and optical apparatus including the same 有权
光子芯片具有高效的光学对准和粘合以及包括其的光学设备

Photonics chip with efficient optical alignment and bonding and optical apparatus including the same
摘要：
Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.
摘要（中）：

提供了一种光子学芯片和包括其的光学装置。 芯片可以包括基板，光波导，光耦合器和多个对准单元。 光波导形成在基板上。 光耦合器形成在光波导处。 对准单元对准在衬底上固定耦合到光耦合器的至少一个光纤的光连接器。

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