Invention Grant
- Patent Title: Detecting defects on a wafer
- Patent Title (中): 检测晶圆上的缺陷
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Application No.: US13193492Application Date: 2011-07-28
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Publication No.: US08605275B2Publication Date: 2013-12-10
- Inventor: Lu Chen , Qiang Zhang
- Applicant: Lu Chen , Qiang Zhang
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G01N21/00
- IPC: G01N21/00
Abstract:
Systems and methods for detecting defects on a wafer are provided. One method includes combining first image data and second image data, generated using different output generated using different values for focus of an inspection system, corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer and detecting defects on the wafer using the additional image data.
Public/Granted literature
- US20120044486A1 Detecting Defects on a Wafer Public/Granted day:2012-02-23
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