Invention Grant
- Patent Title: Modular test switch
- Patent Title (中): 模块化测试开关
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Application No.: US12873976Application Date: 2010-09-01
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Publication No.: US08604366B2Publication Date: 2013-12-10
- Inventor: Andrew Bower , Timothy F. Masters , Roy Ball
- Applicant: Andrew Bower , Timothy F. Masters , Roy Ball
- Applicant Address: CH Zurich
- Assignee: ABB Technology AG
- Current Assignee: ABB Technology AG
- Current Assignee Address: CH Zurich
- Agent Paul R. Katterle; Melissa J. Szczepanik
- Main IPC: H01H9/26
- IPC: H01H9/26 ; H01H13/72
Abstract:
A modular test switch assembly includes a plurality of stackable features that may be arranged in a variety of configurations. Each module includes a test switch and includes features to engage adjoining modules in the assembly. The entire test switch assembly is secured together using a retaining rod that is inserted through aligned thru-holes in the assembly.
Public/Granted literature
- US20110056819A1 MODULAR TEST SWITCH Public/Granted day:2011-03-10
Information query
