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发明授权
US08598686B2 Electronic device package structure with a hydrophilic protection layer and method for fabricating the same 有权
具有亲水保护层的电子器件封装结构及其制造方法

Electronic device package structure with a hydrophilic protection layer and method for fabricating the same
摘要：
The invention provides an electronic device package structure and method of fabrication thereof. The electronic device package structure includes a chip having an active surface and a bottom surface. A dielectric layer is disposed on the active surface of the chip. At least one trench is formed through the dielectric layer. A first protection layer covers the dielectric layer and sidewalls of the trench. A second protection layer covers the first protection layer, filling the trench.
摘要（中）：

本发明提供一种电子器件封装结构及其制造方法。 电子器件封装结构包括具有有源表面和底表面的芯片。 电介质层设置在芯片的有源表面上。 通过介电层形成至少一个沟槽。 第一保护层覆盖电介质层和沟槽的侧壁。 第二保护层覆盖第一保护层，填充沟槽。

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