Disclosed is an expanded polypropylene copolymer resin particle whose base resin is a polypropylene random copolymer resin having a melting point of not more than 145° C., the base resin having a H/W ratio of not more than 8 where H (%) is a maximum height of an elution peak and W (° C.) is a peak width at half a height of the peak in an elution curve obtained from a differential value of eluted content measured by cross fractionation chromatography, and a ratio (Mw/Mn) of a weight-average molecular weight (Mw) and a number-average molecular weight (Mn) being not less than 3.5 in a molecular weight distribution measurement of a whole of eluted components. With such an expanded polypropylene copolymer resin particle, it is possible to provide expanded polypropylene copolymer resin particles which are capable of producing an in-mold expansion-molded article with a low molding heating vapor pressure, and which causes few deformation or shrinkage of an obtained in-mold expansion-molded article (i.e. having a broad molding heating temperature range) even if the in-mold expansion molding is carried out with a high molding heating vapor pressure and has a low decrease in physical properties such as compression strength.