Invention Grant
- Patent Title: Vertical pressure sensor
- Patent Title (中): 垂直压力传感器
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Application No.: US13446473Application Date: 2012-04-13
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Publication No.: US08596133B2Publication Date: 2013-12-03
- Inventor: Chul-Sub Lee , Young-Deok Kim , Eul-Chul Byeon , Yong Hun Lee
- Applicant: Chul-Sub Lee , Young-Deok Kim , Eul-Chul Byeon , Yong Hun Lee
- Applicant Address: KR Kyungsangbuk-Do
- Assignee: Tyco Electronics Amp Korea Ltd.
- Current Assignee: Tyco Electronics Amp Korea Ltd.
- Current Assignee Address: KR Kyungsangbuk-Do
- Agency: Barley Snyder
- Priority: KR10-2009-0097862 20091014
- Main IPC: G01L9/04
- IPC: G01L9/04

Abstract:
A vertical pressure sensor having a fluid deforming pressure application unit, a sensor housing, a socket, a circuit board, a plurality of electrode terminals, and a plurality of electrical signal transmitting electrode rods. The pressure application unit includes a diaphragm to which strain gauges are attached. The socket surrounds a circumference of the diaphragm of the pressure application unit and includes a receiving passageway. The plurality of electrode terminals are provided at the upper end of the socket in a Wheatstone bridge circuit pattern. The plurality of electrode terminals protrude from the upper end of the socket to constitute an electrode tip. The circuit board connects to the plurality of electrode terminals to convert a pressure value into an electrical signal, and the plurality of electrode rods are connected to the circuit board to transmit the electrical signal outside.
Public/Granted literature
- US20120297886A1 Vertical Pressure Sensor Public/Granted day:2012-11-29
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