发明授权
- 专利标题: Three dimensional stacked nonvolatile semiconductor memory
- 专利标题(中): 三维堆叠非易失性半导体存储器
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申请号: US13738660申请日: 2013-01-10
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公开(公告)号: US08582361B2公开(公告)日: 2013-11-12
- 发明人: Hiroshi Maejima
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2008-112660 20080423
- 主分类号: G11C16/04
- IPC分类号: G11C16/04
摘要:
In a three dimensional stacked nonvolatile semiconductor memory according to the present invention, a first block has a selected first cell unit including a memory cell to be read and a non-selected second cell unit not including a memory cell to be read. A read potential or a transfer potential higher than the read potential is applied to the word line in the first block in a state that a ground potential is applied to a channel of a memory cell existing nearer to the bit line side than a memory cell in the second cell unit to which the read potential is applied, after which all the memory cells in the second cell unit are cut off from the bit line, the bit line is set to a precharge potential, and read is performed to the a memory cell to be read in the first cell unit.
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