Invention Grant
- Patent Title: Foamed resin injection molding method
- Patent Title (中): 发泡树脂注塑法
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Application No.: US13124017Application Date: 2010-08-05
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Publication No.: US08574473B2Publication Date: 2013-11-05
- Inventor: Haoliang Michael Sun , Ellen Cheng-chi Lee , Junko Pauken
- Applicant: Haoliang Michael Sun , Ellen Cheng-chi Lee , Junko Pauken
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Price Heneveld LLP
- Agent Vichit Chea
- International Application: PCT/US2010/044563 WO 20100805
- International Announcement: WO2012/018338 WO 20120209
- Main IPC: B29C44/02
- IPC: B29C44/02
Abstract:
An injection molding apparatus and method are provided. The method includes a molded cavity coupled to a resin injection apparatus which injects molten resin under pressure with a gas such that the resin foams within the mold cavity. An electrical heater is in contact with a first cavity surface, and a cooling medium cools the mold. The resin may include metallic flakes.
Public/Granted literature
- US20120032365A1 FOAMED RESIN INJECTION MOLDING APPARATUS AND METHOD Public/Granted day:2012-02-09
Information query
