发明授权
US08566538B2 Administering thermal distribution among memory modules with call stack frame size management
有权
通过调用堆栈帧大小管理来管理内存模块之间的热分配
- 专利标题: Administering thermal distribution among memory modules with call stack frame size management
- 专利标题(中): 通过调用堆栈帧大小管理来管理内存模块之间的热分配
-
申请号: US13210509申请日: 2011-08-16
-
公开(公告)号: US08566538B2公开(公告)日: 2013-10-22
- 发明人: Cary L. Bates , Nicholas P. Johnson , Justin K. King
- 申请人: Cary L. Bates , Nicholas P. Johnson , Justin K. King
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Biggers & Ohanian, LLP
- 主分类号: G06F12/00
- IPC分类号: G06F12/00
摘要:
Administering thermal distribution among memory modules in a computing system that includes temperature sensors, where each temperature sensor measures temperature of a memory module and thermal distribution is effected by: determining, in real-time by a user-level application in dependence upon the temperature measurements of the temperature sensors, whether a memory module is overheated; if a memory module is overheated and if a current call stack frame is stored on the overheated memory module, increasing, by the user-level application, a size of the current call stack frame to fill remaining available memory space on the overheated memory module, ensuring a subsequent call stack frame is stored on a different memory module.
公开/授权文献
信息查询